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product 108 C 19376 specification rev.d 10/sep/2012 tyco electronics nederland b.v. this information is confidential and propriety to te this specificatio n is a controlled document and subject to 1 of 13 connectivity and its worldwide subsidiaries and aff iliates. change. contact the engineering control or ganization for all international rights reserved it may not be dis closed to anyone, other than te the latest revision . te connectivity connectivity personnel, without wri tten authorization from te connectivity corporation, harisburg, pennsylvani a usa *trademark r6-76 (rev. 03-00) loc h 1 scope 1.1 content this specification covers the performance, test and quality requirements for the tyco electronics high speed 8 pairs io board and cable connector. the cab le plug assembly is used to connect the cable to th e board connector. 1.2 qualification when tests are performed on subject product, proced ures specified in this product specification shall be used. all inspections shall be performed using appl icable inspection plan and product drawing. 1.3 applicable partnumbers the partnumbers of subject products: x-2042847-x hsio cable plug assembly x-2042853-x hsio board connector assembly, versio n 1 (referred to as bcv1) x-1551966-x hsio board connector assembly, versio n 2 (referred to as bcv2) 1.4 completion qualification testing of the hsio board connector a ssembly version 1 has successfully been completed on 20jul2011 and is reported in qualification test report with number 501-19154. this documentation is on file and available from engineering practices and standards (eps). qualification testing of hsio board connector assem bly version 2 is yet to be completed. 2 applicable documents the following documents form a part of this specifi cation to extend specified herein. unless otherwise specified, latest edition of the document applies. in the event of conflict between the requirements i n this specification and the product drawing, product draw ing shall take precedence. in the event of conflict between requirements of this specification and refe renced documents, this specification shall take precedence. 2.1 tyco documents 501-19154 test report. cable/board high speed conne ctor assembly (version 1). 114-19129 application specification high speed cabl e/board connector system. 2.2 other documents iec 60512 basic testing procedures and measuring me thods for electromechanical components for electronic equipment. j. smits date 10 sep 2012 t de boer date 10 sep 2012
108-19376 rev. d page 2 of 13 r6-77 (rev. 03-00) 3 requirements: 3.1 design and construction. products shall be of design, construction and physi cal dimensions as specified on the applicable customer product drawings c-2042847 (cable-connecto r), c-2042847 (board connector version 1) and c-1551966 (board-connector version 2). 3.2 materials and finish. materials used in the construction of this product shall be as specified on the applicable customer drawing. 3.3 ratings a. data-rate (differential) - 10 gb/s b. impedance - 100 ohm c. operating voltage - 30 volt dc max. d. current - 0,5 amp max. e. operating temperature - -55c to 105c. f. durability - 100 cycles.
108-19376 rev. d page 3 of 13 r6-77 (rev. 03-00) 3.4 performance and test description. the product is designed to meet mechanical and envi ronmental performance specified in this paragraph as tested per test sequence specified in paragraph 3.5. unless otherwise specified, all tests are performed at ambient environmental conditions per iec specification 60068-1 clause 5.3 and are performed with connectors in mated condition. v i s u a l para test description performance requirements or severity procedures 3.4.1. examination of product meets requirements of product drawing and applicable instructions on customer drawing, instruction sheet, application specification. visual, dimensional and functional per applicable inspection plan. e l e c t r i c a l para test description performance requirements or severity procedures 3.4.2 termination resistance board connector C cable connector (signal and ground) max. open voltage 20mv. max. current 100 ma dc. all contacts to be measured. measuring points shall be as indicated in fig.1 requirement: 30 m w max. (initial; exclusive bulk) 40 m w max. (final; exclusive bulk) in acc. with iec 60512-2-1 3.4.3 termination resistance board connector C cable connector (shield) max. open voltage 20mv. max. current 100 ma dc. measuring points shall be as indicated in fig 2. requirement: initial: 10 m w max. final: 20 m w max. in acc. with iec 60512-2-1 3.4.4 insulation resistance test voltage 100v dc. duration: 1 minute. test between adjacent contacts. requirement: 10 3 m w min. in acc. with iec 60512-3-1 3.4.5 voltage proof test voltage 300 vdc for adjacent contacts. duration 1 minute. requirement: no break-down or flash-over in acc. with iec 60512-4-1 3.4.6 current temperature de-rating curve temperature rise: 30 c maximum over ambient temperature (65 c) at 0,5 a in acc. with iec 60512-5-2 / test 5b
108-19376 rev. d page 4 of 13 r6-77 (rev. 03-00) m e c h a n i c a l para test description performance requirements or severity procedures 3.4.10 signal contact spring force min. 0,5n at deflection of 0.165 mm. 3.4.11 shielding contact spring force (outside springs on bcv1) min. 2,5n at deflection: till board connector shield 3.4.12 shielding contact spring force (outside springs on bcv2) min. 2,5n at a=0,25mm (see figure 3) at required deflection to reach dimension a (see figure 3). maximum deflection to be applied: a=0,15mm. 3.4.13 shielding contact spring force (inside-bended springs on board connector version 2) min. 1,0n at b=0,25mm (see figure 4) at required deflection to reach dimension b (see figure 5). maximum deflection to be applied: b=0,15mm. 3.4.14 vibration 10-500 hz sweeping 1 oct./min., displacement 0,75mm peak/accel. 10 g , 30 minutes in each of 3 mutual perpendicular axes. requirement: no physical damage. no discontinuity > 1 m sec. in acc. with iec 60068-2-6 3.4.15 physical shock subject connector to 50 g half sine shock pulses of 11 ms duration. 6 shocks in two directions of 3 mutual perpendicular axes. in acc. with iec 60512-6-3 3.4.16 insertion-force during wrong polarization. apply 100 n straight force at the cable connector (placed upside down) in mating direction during 10 sec. requirement: no functional damaging and no electrical contacting on signal-traces. in acc. with iec 60512-15-1 3.4.17 mate / un-mate force without latch. mate and un-mate connector-pair. speed: 2 mm/sec. rest 30 sec min. requirement: total mating force 50 n max. total un-mating force 10 n min to 40 n max. in acc. with iec 60512-13-2 3.4.18 mechanical operation (inclusive latch) mate and un-mate specimens for 100 cycles at a maximum rate of 500 cycles per hour with cage latch operable at room conditions. in acc. with iec 60512-9-1
108-19376 rev. d page 5 of 13 r6-77 (rev. 03-00) 3.4.19 side-load in 4 directions (up-down- right-left). cable connector mated on board connector. bcv1: apply 40 n on cable-connector in every direction ( individually) (at 27mm from edge of pcb), during 10 sec. (see figure 5) bcv2: apply 60 n on cable-connector in every direction (individually) (at 27mm from edge of pcb) , during 10 sec. (see figure 5) requirement: no functional damage, latch should be in place. in acc. with iec 60512-17-3 3.4.21 locking latch strength apply 100 n straight force a t the mated cable connector, in un-mating direction. in acc. with iec 60512-15-1 3.4.22 rotational pull force (not applicable for bcv1) load cabled module into board-connector. apply an axial pull-force of 60n on the cable, the pull- force will be in a 33 degrees angle with the axial direction of the connector. rotate the load 3 full rotations (1080 degrees) with respect to the axial direction of the connector. requirement: plug shall remain mated with no evidence of housing damage. 3.4.23 mounting-force board- connector. (not applicable for bcv1) measure force necessary to push the board- connector into the host board at a maximum rate of 12.7mm per minute. requirement: 20n maximum. s i g n a l i n t e g r i t y para test description performance requirements or severity procedures 3.4.30 characteristic impedance time domain (tdr) measurement impedance profile : the test board, pcb cable conne ctor and 1000ps cable rise-time of incident pulse : 30ps (10%-90%) pairs 15-16 and 18-19 requirement : 100 +/- 10%; 100 -20% for footprint for time period of 250ps iec 60512-25-7 3.4.31 skew time domain (tdt) measurement risetime of incident pulse: 30ps (10%-90%) pairs 15-16 and 18-19 samples : 1m and 8m requirement : 15ps iec 60512-25-4
108-19376 rev. d page 6 of 13 r6-77 (rev. 03-00) 3.4.32 return loss frequency domain (fdr) s-parameter meas urement pairs 15-16 and 18-19 samples : 1m with awg26 requirement : ieee 802.3ap for 10gbasekr -3db. iec 60512-25-5 reference : ieee std 802.3ap- 2007 C amendment to ieee std 802.3- 2005:csma/cd C annex 69b 3.4.33 insertion loss frequency domain (fdt) s-parameter m easurement pairs 15-16 and 18-19 samples : 1m, 4m and 8m with awg26 requirement : ieee 802.3ap for 10gbasekr 1.1db/ghz -0.5db @ 1ghz to 5ghz for 1m with awg26 suck out frequency (resonance) > 8ghz iec 60512-25-5 reference : ieee std 802.3ap- 2007 C amendment to ieee std 802.3- 2005:csma/cd C annex 69b 3.4.34 cross talk frequency domain (fdt) s-parameter measu rement samples : 1m, 4m, 8m with awg26 requirement on 1m: pairs 15-16 and 18-19 - next < -30db up to 1ghz. all pairs - power sum next and fext < -24db up to 1ghz. iec 60512-25-1 3.4.35 insertion loss to cross talk ratio over 10gbps link frequency domain (fdt) s-parameter measurement pairs 15-16 and 18-19 samples : 1m, 4m and 8m with awg26 requirement : samples 1m and 4m - ieee 802.3ap for 10gbasekr samples 8m - < -55db up to 100mhz - < -36db up to 1ghz - < -28db up to 2.5ghz - < -23db up to 5.0ghz calculated values based on 3.4.11 and 3.4.12 3.4.36 screening attenuation samples : 1m with awg26 requirement : < -40db at 0 to 5ghz for cable assembly and pcb connector iec 62153-4-4 and iec 62153-4-7 3.4.37 time delay rx to tx max 400ps asymmetry between pairs (rx - tx) measure ments to be performed on 1m and 8m cable assemblies
108-19376 rev. d page 7 of 13 r6-77 (rev. 03-00) e n v i r o n m e n t a l para test description performance requirements or severity procedures 3.4.40 rapid change of temperature -40/90c, 0,5 hrs / 0,5 hrs, 5 cycles in acc. with iec 60512-11-4 3.4.41 climatic sequence dry heat 1 st damp heat cycle cold 2 nd damp heat cycle 90c, 16 hrs 25/55c, rh 93%, 24 hrs -40c, 2 hrs 25/55c, rh 93%, 24 hrs in acc. with iec 60512-11-1 3.4.42 damp/heat steady state temperature 40c, rh 93%, duration: 21 days in acc. with iec 60512-11-3 3.4.43 temperature life. subject mated specimens to 105c for 240 hours without electrical load. in acc. with iec 60512-11-9 3.4.44 corrosion mixed flowing gas temperature 25c, rh 75%, cl 2 10 ppb, no 2 200 ppb, h2s 10 ppb, so 2 200 ppb. duration: 20 days (un-mated) in acc. with iec 60512-11-7 3.4.45 resistance to soldering heat board connector specimens were subject to the following reflow profile. fig 6 tyco 109-201, method c
108-19376 rev. d page 8 of 13 r6-77 (rev. 03-00) figure 1 figure 2
108-19376 rev. d page 9 of 13 r6-77 (rev. 03-00) figure 3 figure 4
108-19376 rev. d page 10 of 13 r6-77 (rev. 03-00) figure 5 260 0 50 100 150 200 250 300 0 30 60 90 120 150 180 210 240 270 300 330 360 sec deg c figure 6
108-19376 rev. d page 11 of 13 r6-77 (rev. 03-00) 3.5 product qualification and requalification test sequence 3.5.1 test sequence applicable for board connector version 1
108-19376 rev. d page 12 of 13 r6-77 (rev. 03-00) 3.5.2 test sequence applicable for hsio board conne ctor version 2
108-19376 rev. d page 13 of 13 r6-77 (rev. 03-00) 4 quality assurance provisions. 4.1 qualification testing. sample selection. samples shall be prepared in accordance with applic able instructions and shall be selected random from current production. unless details to perform test require otherwise, p lugs shall be terminated on cables according to applicable instructions and requirements specified in appropriate application specification and instru ction sheet. unless otherwise specified all test groups shall co nsist of a minimum of 5 connectors of applicable ty pe. qualification inspection shall be verified by testi ng samples as specified in para 3.5. 4.2 requalification testing. if changes significantly affecting form, fit or fun ction are made to product or manufacturing process, product assurance shall coordinate re-qualification testing, consisting of all or part of original tes ting sequence as determined by product, quality and reli ability engineering. 4.3 acceptance. acceptance is based on verification that product me ets requirements of para 3.4. failures attributed t o equipment, test set-up, test sub-components or oper ator deficiencies shall not disqualify the product. when product failure occurs, corrective action shal l be taken and samples resubmitted for qualificatio n. testing to confirm corrective action is required be fore re-submittal. 4.4 quality conformance inspection. applicable tyco electronics quality inspection plan will specify sampling acceptable quality level to be used. dimensional and functional requirements shall be in accordance with applicable product drawing and this specification.

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